The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
May. 15, 2017
Applicant:
Dnae Group Holdings Limited, London, GB;
Inventor:
Zahid Ansari, Cambridge, GB;
Assignee:
DNAE GROUP HOLDINGS LIMITED, London, GB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/414 (2006.01); H01L 23/31 (2006.01); H01L 27/088 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/4148 (2013.01); G01N 27/414 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 27/088 (2013.01); H01L 24/04 (2013.01); H01L 24/48 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/1815 (2013.01);
Abstract
An assay device () is provided. The device comprises an integrated circuit (IC) () comprising a plurality of ISFETs (); an over-moulded layer () which partially covers the IC, such that the plurality of ISFETs remain uncovered; and a film () provided across substantially the entire IC. The film acts as a passivation and/or sensing layer for each of the ISFETs. In addition, the film acts as a barrier layer to encase the over-moulded layer.