The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jun. 24, 2015
Applicant:

Conti Temic Microelectronic Gmbh, Nuremberg, DE;

Inventors:

Juergen Henniger, Erlangen-Dechsendorf, DE;

Matthias Keuten, Altdorf, DE;

Matthias Wieczorek, Neunkirchen am Sand, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); B29C 65/08 (2006.01); B29C 65/16 (2006.01); B29C 65/00 (2006.01); B29L 31/00 (2006.01); B29C 65/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); B29C 65/08 (2013.01); B29C 65/16 (2013.01); B29C 65/02 (2013.01); B29C 65/1635 (2013.01); B29C 66/543 (2013.01); B29K 2995/0003 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/34 (2013.01); B29L 2031/752 (2013.01);
Abstract

A sensor module contains a sensor unit, a sensor cover, and a main body. The sensor unit has a sensor surface and a base surface. The sensor cover covers the sensor surface and at least a section of the base surface. The sensor cover is connected to the base surface and/or the main body by a fused connection. The main body is connected at least to the base surface of the sensor unit by a fused connection with a selectable relative position in relation to the sensor cover. Pre-mounting of the sensor unit in a sensor cover and advantageous encapsulation of a sensor can thus be achieved.


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