The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

May. 28, 2015
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Shintaro Abe, Kanagawa, JP;

Rikia Furusho, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 163/04 (2006.01); H01L 23/00 (2006.01); C09J 11/08 (2006.01); C09K 5/14 (2006.01); C09J 163/00 (2006.01); C09J 11/04 (2006.01); C08G 59/50 (2006.01); C09J 11/06 (2006.01); H01L 23/373 (2006.01); C09J 121/00 (2006.01); H01B 1/22 (2006.01); H01B 1/02 (2006.01); C08G 59/62 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C08G 59/504 (2013.01); C08G 59/5033 (2013.01); C08G 59/621 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 11/08 (2013.01); C09J 121/00 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); C09K 5/14 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H01L 23/3737 (2013.01); H01L 24/29 (2013.01); C08K 2003/0806 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29298 (2013.01); H01L 2224/29339 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/2075 (2013.01); H01L 2924/20751 (2013.01);
Abstract

The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 μm, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.


Find Patent Forward Citations

Abe, Shintaro. (2020). Thermally and electrically conductive adhesive composition (U.S. Patent No. 10633564). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10633564

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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