The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Jan. 27, 2017
Tesa SE, Norderstedt, DE;
Hans Karl Engeldinger, Quickborn, DE;
Judith Grünauer, Hamburg, DE;
Klaus Keite-Telgenbüscher, Hamburg, DE;
TESA SE, Norderstedt, DE;
Abstract
A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.