The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Oct. 09, 2018
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masaya Uyama, Kawasaki, JP;

Tadanobu Nagami, Yamato, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1629 (2013.01); B41J 2/1603 (2013.01); B41J 2/1628 (2013.01); B41J 2/1631 (2013.01); B41J 2/1632 (2013.01); B41J 2/1635 (2013.01); B41J 2/1642 (2013.01); B41J 2/1645 (2013.01); B41J 2/1646 (2013.01);
Abstract

A perforated substrate having a first surface, a second (opposite) surface, a plurality of through holes running through the substrate from the first surface to the second surface and an etching object arranged on the first surface, is processed by forming a coating layer containing a resin material on the etching object, then allowing part of the resin material to drop into each of the through holes so as to close each of the through holes at least partly with the dropped resin material, then patterning the coating layer such that the coating layer is left on each of the through holes as mask while at least part of the coating layer covering the etching object is removed to expose the etching object; and etching the exposed etching object under a condition where each of the through holes is closed at least partly with the resin material.


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