The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jul. 26, 2018
Applicant:

Playnitride Inc., Tainan, TW;

Inventors:

Yun-Li Li, Tainan, TW;

Tzu-Yang Lin, Tainan, TW;

Yu-Hung Lai, Tainan, TW;

Pei-Hsin Chen, Tainan, TW;

Assignee:

PlayNitride Inc., Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01); H01L 21/683 (2006.01); H01L 27/15 (2006.01); B32B 38/10 (2006.01); B32B 37/12 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
B32B 38/10 (2013.01); B32B 37/12 (2013.01); H01L 21/6835 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/0079 (2013.01); H01L 33/40 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81 (2013.01); H01L 2224/95 (2013.01);
Abstract

A method of transferring micro devices is provided. A carrier substrate including a buffer layer and a plurality of micro devices is provided. The buffer layer is located between the carrier substrate and the micro devices. The micro devices are separated from one another and positioned on the carrier substrate through the buffer layer. A receiving substrate contacts the micro devices disposed on the carrier substrate. A temperature of at least one of the carrier substrate and the receiving substrate is changed after the micro devices contact the receiving substrate. At least a portion of the micro devices are transferred from the carrier substrate onto the receiving substrate after changing the temperature of at least one of the carrier substrate and the receiving substrate.


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