The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Sep. 13, 2018
Applicant:

Kikusui Seisakusho Ltd., Kyoto-shi, JP;

Inventors:

Satoshi Shimada, Kyoto, JP;

Tomohiro Kakitani, Kyoto, JP;

Hiroshi Suzuki, Kyoto, JP;

Hitoshi Kusunoki, Kyoto, JP;

Satoru Watano, Sakai, JP;

Assignee:

KIKUSUI SEISAKUSHO LTD., Kyoto-Shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/34 (2006.01); B30B 11/10 (2006.01); B30B 11/00 (2006.01); B30B 15/26 (2006.01); B30B 15/32 (2006.01); B30B 15/02 (2006.01); B30B 15/30 (2006.01); B30B 15/00 (2006.01); B30B 11/08 (2006.01); B65G 47/84 (2006.01); B29C 43/08 (2006.01);
U.S. Cl.
CPC ...
B30B 11/10 (2013.01); B30B 11/005 (2013.01); B30B 11/08 (2013.01); B30B 15/0023 (2013.01); B30B 15/022 (2013.01); B30B 15/26 (2013.01); B30B 15/302 (2013.01); B30B 15/32 (2013.01); B65G 47/846 (2013.01); B29C 43/08 (2013.01);
Abstract

A molded product processing system is configured to apply a post process to a molded product molded by a compression-molding machine. The system includes modules each including a conveying mechanism configured to convey a plurality of molded products P kept aligned, and a processing mechanism confronting a travel route of the molded products conveyed by the conveying mechanism and configured to apply a predetermined post process to each of the conveyed molded products, in which upstream one of the modules and downstream one of the modules are connected to allow the molded products having gone through certain processing at the upstream one of the modules to be delivered to the downstream one of the modules and be subjected to a different predetermined processing at one of the modules.


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