The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Aug. 07, 2017
Applicant:

Canon U.s.a., Melville, NY (US);

Inventors:

Gregory A. Dale, Gaithersburg, MD (US);

Kenton C. Hasson, Germantown, MD (US);

Shulin Zeng, Silver Spring, MD (US);

Michele Stone, Rockville, MD (US);

Assignee:

Canon U.S.A., Inc., Melville, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C12Q 1/68 (2018.01); B01L 7/00 (2006.01); B01L 3/00 (2006.01); G01N 21/03 (2006.01); G01N 21/05 (2006.01); G01N 21/64 (2006.01);
U.S. Cl.
CPC ...
B01L 7/525 (2013.01); B01L 3/5027 (2013.01); B01L 2300/0654 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0861 (2013.01); B01L 2300/0883 (2013.01); B01L 2300/1822 (2013.01); B01L 2300/1827 (2013.01); B01L 2300/1838 (2013.01); B01L 2400/0487 (2013.01); G01N 21/0332 (2013.01); G01N 2021/0346 (2013.01); G01N 2021/058 (2013.01); G01N 2021/6439 (2013.01);
Abstract

An apparatus for performing a thermocyclic process, such as amplifying DNA, includes a microfluidic chip with a channel formed therein and one or more thermal distribution elements disposed over portions of the chip. Each thermal distribution element is configured to distribute thermal energy from an external thermal energy source substantially uniformly over the portion of the chip covered by the thermal distribution element. The portion of the chip covered by the thermal distribution element thereby comprises a discrete temperature zone. Other temperature zones can be defined by other thermal distribution elements or by portions of the chip not covered by a thermal distribution element. The channel is configured so that a fluid flowing through the channel would enter and exit the different temperature zones a plurality of times, thereby alternately exposing the fluid to the temperature of each zone for a period of time required for the fluid to traverse the zone.


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