The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Sep. 15, 2015
Applicant:

The Trustees of the University of Pennsylvania, Philadelphia, PA (US);

Inventors:

David Issadore, Philadelphia, PA (US);

Melaku Muluneh Woldermariam, Philadelphia, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); B81B 1/00 (2006.01); B81B 7/00 (2006.01); F15C 5/00 (2006.01); G01N 27/12 (2006.01); F15C 7/00 (2006.01); B81B 7/02 (2006.01);
U.S. Cl.
CPC ...
B01L 3/502707 (2013.01); B01L 3/502715 (2013.01); B01L 3/502761 (2013.01); B01L 3/502776 (2013.01); G01N 27/128 (2013.01); B01L 2200/02 (2013.01); B01L 2200/12 (2013.01); B01L 2200/143 (2013.01); B01L 2300/02 (2013.01); B01L 2300/0627 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01);
Abstract

A microfluidic device includes an integrated circuit and a first substrate layer having a first surface and a second surface. The first surface of the first substrate layer is connected to the integrated circuit. The first substrate layer is in fluid communication with the integrated circuit. The microfluidic device also includes a second substrate layer having a surface area substantially larger than that of the first substrate layer. The second substrate layer includes a first and second surface. The first surface of the second substrate layer is connected to the second surface of the first substrate layer. The second substrate layer includes a first fluid inlet. The second substrate layer is in fluid communication with the integrated circuit through the first substrate layer.


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