The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jun. 03, 2015
Applicant:

Fuji Corporation, Chiryu-shi, JP;

Inventors:

Daisuke Suzuki, Anjo, JP;

Seiji Shibata, Okazaki, JP;

Satoshi Iwashima, Chiryu, JP;

Assignee:

FUJI CORPORATION, Chiryu-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 13/08 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0413 (2013.01); H01L 21/6838 (2013.01); H05K 13/0409 (2018.08); H05K 13/082 (2018.08);
Abstract

A component mounting machine which deals with a component remaining on a nozzle of a mounting head includes a board conveyance device conveying a board to a predetermined position, a component supply device accommodating multiple components therein, a component mounting device on which a mounting head which picks up and holds a component by vacuum pumping of a suction nozzle is installed and which mounts a component which is taken out from the component supply device onto a board which is conveyed by the board conveyance device, and a control device controlling each of the devices. The component mounting device performs lowering of the component, releasing the component with respect to the suction nozzle of the mounting head, a first lifting of the component to a middle height, a component pickup performed at the height of the first lifting, and a second lifting after the component pickup.


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