The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Apr. 20, 2018
Applicant:

Sakai Display Products Corporation, Osaka, JP;

Inventors:

Shodo Yamasaki, Osaka, JP;

Shunsuke Okajima, Osaka, JP;

Nobuhiro Yonezawa, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); H05K 3/36 (2006.01); G02F 1/13 (2006.01); G09F 9/30 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
H05K 3/361 (2013.01); G02F 1/1303 (2013.01); G02F 1/133305 (2013.01); G09F 9/301 (2013.01); G02F 1/13452 (2013.01); G02F 2202/28 (2013.01);
Abstract

A compression bonding apparatus for compression bonding a component on a plate-shaped member, includes a holding part for holding the plate-shaped member vertically, a moving part being movable with respect to the holding part, a measurement unit configured to optically measure a position and an orientation of the moving part, a driving unit for varying the position and the orientation of the moving part, a first compression bonding unit configured to temporarily fix the component on the plate-shaped member at a predetermined temperature and pressure, and a second compression bonding unit configured to compression bond the component on the plate-shaped member at higher temperature and pressure than the predetermined temperature and pressure in compression bonding by the first compression bonding unit.


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