The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Aug. 08, 2016
Applicant:

Baker Hughes Incorporated, Houston, TX (US);

Inventors:

Rocco Difoggio, Houston, TX (US);

Otto N. Fanini, Houston, TX (US);

Paul G. Cairns, Houston, TX (US);

Brian D. Breaux, Houston, TX (US);

Benjamin Todd, Cypress, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); H05K 1/18 (2006.01); E21B 47/01 (2012.01); H05K 3/32 (2006.01); E21B 49/00 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01); B33Y 10/00 (2015.01); B23K 26/18 (2006.01); G01V 3/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B23K 1/0056 (2013.01); E21B 47/011 (2013.01); E21B 49/00 (2013.01); H05K 1/113 (2013.01); H05K 3/325 (2013.01); H05K 3/341 (2013.01); B23K 26/18 (2013.01); B33Y 10/00 (2014.12); G01V 3/18 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10257 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10401 (2013.01); H05K 2201/10628 (2013.01); H05K 2203/107 (2013.01);
Abstract

Methods, systems, devices, and products for manufacturing an electrical assembly, such as a completed downhole circuit board, for use in well logging. Methods include attaching an electrical component to a printed circuit board by mechanically fastening the electrical component to the printed circuit board. Methods may include using a laser to attach a plurality of legs to contact surfaces. Methods may include applying light from the laser to a material of the printed circuit board to produce heat, including mitigating reflection of the light from the material. Methods include forming a connection between a first electrical component of the electrical assembly and a second electrical component of the electrical assembly by causing heating of an additive manufacturing material by applying light from a laser. The connection may be at least one of: i) an electrical connection; ii) a structural connection; iii) an electrical insulation.


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