The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Jul. 11, 2019
Applicant:
Casio Computer Co., Ltd., Shibuya-ku, Tokyo, JP;
Inventors:
Kenji Iwamoto, Kokubunji, JP;
Satoshi Kurosawa, Tokyo, JP;
Assignee:
CASIO COMPUTER CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 1/0201 (2013.01); H05K 1/029 (2013.01); H05K 1/0287 (2013.01); H05K 1/189 (2013.01); H05K 3/0005 (2013.01); H05K 3/28 (2013.01); H05K 3/4664 (2013.01); H05K 2201/06 (2013.01); H05K 2203/1105 (2013.01);
Abstract
A microcapsule includes a shell including a conducting component; and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have a conducting state with the other capsule.