The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Nov. 16, 2018
Applicant:

Continental Automotive Gmbh, Hannover, DE;

Inventor:

Anton Mayer-Dick, Regensburg, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 7/00 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/0206 (2013.01); H05K 1/181 (2013.01); H05K 1/0259 (2013.01); H05K 2201/066 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/10166 (2013.01);
Abstract

An electronic module with reduced electromagnetic interference radiation includes a multilayer printed circuit board having an electrically conductive outer layer and at least one electrically conductive inner layer, an electronic component, a heat sink and a plurality of thermal plated-through holes. The electronic component is disposed on and electrically connected to the outer layer. The heat sink is thermally connected to the multilayer printed circuit board by an electrical insulation layer. Heat generated during operation of the electronic component can be dissipated to the heat sink through the plurality of thermal plated-through holes. The plurality of thermal plated-through holes do not have an electrical connection to the outer layer.


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