The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Oct. 20, 2016
Applicant:
Ngk Insulators, Ltd., Nagoya, JP;
Inventors:
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/00 (2006.01); H05B 3/06 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H05B 3/28 (2006.01);
U.S. Cl.
CPC ...
H05B 3/06 (2013.01); H01L 21/67103 (2013.01); H01L 21/68757 (2013.01); H01L 21/68792 (2013.01); H05B 3/283 (2013.01); H05B 2203/017 (2013.01);
Abstract
A member for a semiconductor manufacturing apparatus according to the present invention is a member that is to be joined to an aluminum nitride base member. The member is composed of a composite material including principal constituent phases that are aluminum nitride and a pseudopolymorph of aluminum nitride which includes silicon, aluminum, oxygen, and nitrogen. The pseudopolymorph of aluminum nitride has at least one periodic structure selected from a 27R phase and a 21R phase or an X-ray diffraction peak at least at 2θ=59.8° to 60.8°. The composite material has a thermal conductivity of 50 W/mK or less at room temperature.