The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Dec. 04, 2014
Applicant:

Daishinku Corporation, Hyogo, JP;

Inventors:

Minoru Iizuka, Kakogawa, JP;

Takuya Kojo, Kakogawa, JP;

Assignee:

DAISHINKU CORPORATION, Kakogawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H03H 9/13 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H03H 3/02 (2013.01); H03H 9/0561 (2013.01); H03H 9/1035 (2013.01); H03H 9/131 (2013.01); H03H 9/17 (2013.01); H01L 2224/16225 (2013.01); H03H 9/1021 (2013.01);
Abstract

A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation with reduced size or height. A crystal resonator includes a crystal resonator plate, a first sealing member and a second sealing member. A sealing-member-side first bonding pattern and a sealing-member-side second bonding pattern, both to be bonded to the crystal resonator plate, are formed respectively on the first and second sealing members. On the crystal resonator plate, a resonator-plate-side first bonding pattern to be bonded to the first sealing member is formed on a first main surface and a resonator-plate-side second bonding pattern to be bonded to the second sealing member is formed on a second main surface. The sealing-member-side first bonding pattern is bonded to the resonator-plate-side first bonding pattern, and the sealing-member-side second bonding pattern is bonded to the resonator-plate-side second bonding pattern, both by diffusion bonding.


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