The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Aug. 28, 2015
Applicant:
Korea Institute of Industrial Technology, Cheonan-si, KR;
Inventors:
Ho Sung Kim, Gwangju, KR;
Min Young Kim, Gwangju, KR;
Byeong Su Kang, Damyanggun, KR;
Sun Woo Yang, Gwangju, KR;
Hee Sook Noh, Gwangju, KR;
Assignee:
KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, Cheonan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/24 (2006.01); H01M 8/0206 (2016.01); H01M 8/0213 (2016.01); H01M 8/0215 (2016.01); H01M 8/0221 (2016.01); H01M 8/0226 (2016.01); H01M 8/18 (2006.01); B29C 43/00 (2006.01); B29C 43/04 (2006.01); B29C 43/14 (2006.01); B29C 43/52 (2006.01); C08L 63/00 (2006.01); B29K 63/00 (2006.01); B29K 505/00 (2006.01); B29K 507/04 (2006.01); B29K 509/02 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01M 8/0226 (2013.01); B29C 43/04 (2013.01); B29C 43/14 (2013.01); B29C 43/52 (2013.01); C08L 63/00 (2013.01); H01B 1/24 (2013.01); H01M 8/0206 (2013.01); H01M 8/0213 (2013.01); H01M 8/0215 (2013.01); H01M 8/0221 (2013.01); H01M 8/188 (2013.01); B29C 43/003 (2013.01); B29C 2043/141 (2013.01); B29C 2043/525 (2013.01); B29K 2063/00 (2013.01); B29K 2505/00 (2013.01); B29K 2507/04 (2013.01); B29K 2509/02 (2013.01); B29L 2031/3468 (2013.01); Y02E 60/528 (2013.01);
Abstract
Disclosed is a method of manufacturing a bipolar plate for a redox flow battery. The method includes (a) mixing epoxy, a curing agent, and a conductive filler to manufacture a mixture, and (b) manufacturing the bipolar plate including a conductive filler composite manufactured by compression-molding the mixture.