The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jul. 20, 2016
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Juergen Moosburger, Lappersdorf, DE;

Lutz Hoeppel, Alteglofsheim, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 23/31 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 21/56 (2013.01); H01L 23/3171 (2013.01); H01L 24/00 (2013.01); H01L 24/05 (2013.01); H01L 33/0079 (2013.01); H01L 33/0095 (2013.01); H01L 33/38 (2013.01); H01L 33/382 (2013.01); H01L 21/561 (2013.01); H01L 24/03 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/94 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A method for producing a component may include providing a composite including a semiconductor layer stack, a first connection layer and a second connection layer, wherein the first and second connection layers are arranged on the semiconductor layer stack, are assigned to different electrical polarities and are configured for the electrical contacting of the component to be produced, applying a molded body material on the composite for forming a molded body, such that in a plan view of the semiconductor layer stack the molded body covers the first connection layer and the second connection layer, forming a first cutout and a second cutout through the molded body for exposing the connection layers in places, and filling the first and second cutouts with an electrically conductive material for forming through contacts which are electrically conductively connected to the connection layers and extend through the molded body in the vertical direction.


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