The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jan. 20, 2017
Applicant:

Delta Electronics (Shanghai) Co., Ltd, Shanghai, CN;

Inventors:

Jianhong Zeng, Shanghai, CN;

Yan Chen, Shanghai, CN;

Le Liang, Shanghai, CN;

Xiaoni Xin, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/50 (2006.01); H01L 23/66 (2006.01); H01L 23/482 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 27/088 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 23/528 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); H01L 23/481 (2013.01); H01L 23/4824 (2013.01); H01L 23/50 (2013.01); H01L 23/528 (2013.01); H01L 23/5222 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/04 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 27/0203 (2013.01); H01L 27/088 (2013.01); H01L 21/568 (2013.01); H01L 24/73 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/08195 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08265 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24245 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A power integrated module, including at least one first bridge formed in a chip, wherein the first bridge includes: a first upper bridge switch, formed by a plurality of first sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first lower bridge switch, formed by a plurality of second sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first electrode, connected to the first end of the first upper bridge switch; a second electrode, connected to the second end of the first lower bridge switch; and a third electrode, connected to the second end of the first upper bridge switch and the first end of the first lower bridge switch, wherein the first, the second and the third electrode are bar-type electrodes arranged side by side.


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