The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Nov. 06, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Suk Youn Hong, Suwon-si, KR;

Jang Hyun Kim, Suwon-si, KR;

Hye Kyung Kim, Suwon-si, KR;

Seung Hyun Hong, Suwon-si, KR;

Jong In Ryu, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/552 (2006.01); H05K 1/02 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H05K 3/28 (2006.01); H05K 3/36 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4814 (2013.01); H01L 21/56 (2013.01); H05K 1/023 (2013.01); H05K 1/141 (2013.01); H05K 3/284 (2013.01); H05K 3/366 (2013.01); H01L 23/5383 (2013.01); H05K 1/181 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10522 (2013.01);
Abstract

An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a shielding wall disposed between the at least one first component and the at least one second component, and disposed on the substrate, and a sealing portion having the at least one first component, the at least one second component and the shielding wall embedded therein, and disposed on the substrate. The shielding wall includes at least one insulating layer and at least one conductive layer disposed on the insulating layer.


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