The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Sep. 10, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Chao Song, San Diego, CA (US);

Ye Lu, San Diego, CA (US);

Haitao Cheng, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 23/522 (2006.01); H01L 27/01 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 23/5228 (2013.01); H01L 27/01 (2013.01);
Abstract

Certain aspects of the present disclosure provide an integrated circuit (IC) that includes at least one of a via-based vertical capacitor structure or a via-based vertical resistor structure. The IC includes a substrate oriented in a horizontal plane, electrically conductive layers disposed above the substrate, and electrically insulative layers disposed above the substrate and interposed between the plurality of electrically conductive layers. At least one of the vertical capacitor structure or the vertical resistor structure is disposed in the electrically conductive layers and the electrically insulative layers.


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