The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Apr. 08, 2014
Mitsubishi Electric Corporation, Tokyo, JP;
Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;
Abstract
An object of this invention is to obtain a molded module with which improvements are achieved in the packaging ability and heat dissipation performance of an inverter module itself, and in the mounting capacity of a peripheral mounting component such as a substrate, which must be taken into consideration in relation to the shape of the module. Provided is a molded module for use in power electronics, having an inbuilt semiconductor element used to supply and control a large amount of power, the molded module including at least one semiconductor switching element provided in the module and a lead frame that dissipates heat from the switching element and electrically connects an element packaged in the module to an external circuit, wherein at least one end of the module is molded in a curved shape or a polygonal shape.