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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629517 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jun. 25, 2018

Semiconductor device and fabrication method thereof

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Koji Ichikawa, Matsusaka, JP;

Kento Shirata, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:

Ngan V Ngo

Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01R 4/02 (2006.01); H01R 43/02 (2006.01); H01L 23/49 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/492 (2013.01); H01L 21/4853 (2013.01); H01L 23/49 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 24/01 (2013.01); H01L 25/072 (2013.01); H01R 4/029 (2013.01); H01R 43/0221 (2013.01); H01L 24/29 (2013.01); H01L 24/33 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15312 (2013.01);
Abstract

A semiconductor device including a connection terminal that is electrically connected to a semiconductor chip, a bus bar with an opening through which the connection terminal passes, and a fusing portion including a jointing portion, which is provided over an upper surface of the bus bar from an upper part of the connection terminal that is positioned above the upper surface of the bus bar by making the connection terminal pass through the opening of the bus bar, is provided.

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Ichikawa, Koji. (2020). Semiconductor device and fabrication method thereof (U.S. Patent No. 10629517). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10629517

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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