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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629505 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Aug. 19, 2016

Electronic component mounting package and electronic device using the same

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Takayuki Shirasaki, Omihachiman, JP;

Masahiko Taniguchi, Kirishima, JP;

Takashi Miyauchi, Kirishima, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Steven T Sawyer

Assistant Examiner:

Paresh H Paghadal

Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/02 (2006.01); H01S 5/022 (2006.01); H01L 23/055 (2006.01); H01L 23/50 (2006.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 23/08 (2006.01); H01L 23/12 (2006.01); H01L 23/10 (2006.01); H01L 23/045 (2006.01); H01L 23/049 (2006.01); H01L 23/047 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/02 (2013.01); H01L 23/055 (2013.01); H01L 23/50 (2013.01); H01L 33/483 (2013.01); H01S 5/022 (2013.01); H01S 5/02276 (2013.01); H01L 23/045 (2013.01); H01L 23/047 (2013.01); H01L 23/049 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 33/62 (2013.01); H01L 33/642 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01); H01S 5/02236 (2013.01);
Abstract

An electronic component mounting package includes a dielectric substrate between first portions of a pair of signal terminals that protrude from one side in a thickness direction from a first face of a base body. This dielectric substrate has a height lower than a height of the first portions. When an electronic component is mounted, a bonding wire is connected to a tip of each of the first portions to electrically connect the first portion to the electronic component.

Find Patent Forward Citations

Shirasaki, Takayuki. (2020). Electronic component mounting package and electronic device using the same (U.S. Patent No. 10629505). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10629505

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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