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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629470 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Nov. 03, 2017

Composite substrate, elastic wave device, and method for producing elastic wave device

Applicant:

Ngk Insulators, Ltd., Aichi, JP;

Inventors:

Ryosuke Hattori, Ichinomiya, JP;

Yuji Hori, Owariasahi, JP;

Tomoyoshi Tai, Inazawa, JP;

Assignee:

NGK INSULATORS, LTD., Aichi, JP;

Attorneys:

Cermak & Nakajima & McGowan LLP

Tomoko Nakajima

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H03H 3/02 (2006.01); H03H 9/25 (2006.01); B32B 18/00 (2006.01); B32B 38/10 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 7/02 (2019.01); H03H 3/10 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); H03H 9/10 (2006.01); B32B 7/06 (2019.01); H01L 21/78 (2006.01); H01L 41/187 (2006.01); H03H 9/02 (2006.01); B32B 37/10 (2006.01); H03H 3/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/02 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 18/00 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 38/10 (2013.01); H01L 21/78 (2013.01); H03H 3/02 (2013.01); H03H 3/10 (2013.01); H03H 9/105 (2013.01); H03H 9/1014 (2013.01); H03H 9/1035 (2013.01); H03H 9/25 (2013.01); B32B 37/10 (2013.01); B32B 2264/105 (2013.01); B32B 2307/20 (2013.01); B32B 2307/206 (2013.01); B32B 2307/538 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2457/00 (2013.01); B32B 2457/14 (2013.01); H01L 41/1873 (2013.01); H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 2003/022 (2013.01); H03H 2003/023 (2013.01); H03H 2003/027 (2013.01); Y10T 29/42 (2015.01); Y10T 29/49005 (2015.01); Y10T 428/12597 (2015.01);
Abstract

A method for producing an elastic wave device includes steps of (a) preparing a first substrate and a second substrate, (b) irradiating a bonding surface of the first substrate and a bonding surface of the second substrate with one of plasma, neutral atom beams, and ion beams of an inert gas, (c) bonding the bonding surface of the first substrate and the bonding surface of the second substrate in a vacuum at room temperature so as to set a strength that allows the first and second substrates to be separated by insertion of a blade; (d) forming a composite substrate by bonding a piezoelectric substrate to another surface of the first substrate; (e) forming electrode on a surface of the piezoelectric substrate of the composite substrate; and then (f) removing the second substrate from the first substrate by separation with the blade.

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