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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629466 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Feb. 18, 2016

Electrostatic chuck device including a heating member

Applicant:

Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;

Inventors:

Tomomi Ito, Tokyo, JP;

Yukio Miura, Tokyo, JP;

Assignee:

SUMITOMO OSAKA CEMENT CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Thienvu V Tran

Assistant Examiner:

Nicolas Bellido

Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 7/12 (2006.01); C09J 183/04 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H02N 13/00 (2006.01); B32B 25/20 (2006.01); B32B 9/04 (2006.01); B32B 9/00 (2006.01); B32B 15/18 (2006.01); B32B 15/16 (2006.01); B32B 5/30 (2006.01); B32B 15/06 (2006.01); B32B 3/10 (2006.01); B32B 15/20 (2006.01); B32B 5/16 (2006.01); B32B 7/04 (2019.01); B32B 3/30 (2006.01); B32B 15/04 (2006.01); C08K 3/22 (2006.01); C09D 183/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); B32B 3/10 (2013.01); B32B 3/30 (2013.01); B32B 5/16 (2013.01); B32B 5/30 (2013.01); B32B 7/04 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 9/043 (2013.01); B32B 15/043 (2013.01); B32B 15/06 (2013.01); B32B 15/16 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 25/20 (2013.01); C09J 183/04 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/68757 (2013.01); H02N 13/00 (2013.01); B32B 2255/20 (2013.01); B32B 2255/205 (2013.01); B32B 2264/102 (2013.01); B32B 2264/107 (2013.01); B32B 2270/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B32B 2307/306 (2013.01); B32B 2307/536 (2013.01); B32B 2307/732 (2013.01); B32B 2457/00 (2013.01); C08K 2003/2227 (2013.01); C09D 183/04 (2013.01);
Abstract

Provided is an electrostatic chuck device which includes: an electrostatic chuck section having one main surface serving as a placing surface on which a plate-shaped sample is placed, and having a built-in internal electrode for electrostatic attraction; a first adhesion layer which contains spacers and a silicone adhesive and in which a layer thickness D is in a range of 3 to 25 μm and a ratio (ϕ/D) between the layer thickness D and an average particle diameter ϕof the spacers is in a range of 0.1 to 1.0; a plurality of heating members bonded to the surface on the side opposite to the placing surface of the electrostatic chuck section in a pattern having a gap with respect to one another by the first adhesion layer; a second adhesion layer which contains a silicone adhesive; and a base section having a function of cooling the electrostatic chuck section.

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