The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

May. 04, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;

Inventors:

Min-su Kim, Suwon-si, KR;

Yong-seok Lee, Hwaseong-si, KR;

Han-shin Shin, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G03F 1/36 (2012.01);
U.S. Cl.
CPC ...
G06F 17/5081 (2013.01); G03F 1/36 (2013.01); G06F 17/504 (2013.01); G06F 17/505 (2013.01); G06F 2217/74 (2013.01);
Abstract

A method of manufacturing an IC includes detecting connectivity between polygons from layout data of the IC and extracting a layout netlist, by performing a DRC on the layout data. The DRC includes loading a rule file including a DRC syntax. The method includes performing LVS verification on the extracted layout netlist and schematic data of the IC to generate LVS result data. The method includes manufacturing the IC according to a layout based on the layout data and the LVS result data.


Find Patent Forward Citations

Loading…