The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jan. 12, 2018
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Yuheng Zhang, Saratoga, CA (US);

Gordon Yee, San Mateo, CA (US);

Yibo Yin, San Mateo, CA (US);

Tz-Yi Liu Liu, Palo Alto, CA (US);

Assignee:

Sandisk Technologies LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G11C 7/22 (2006.01); G11C 29/02 (2006.01); G11C 11/00 (2006.01); G11C 29/50 (2006.01); G11C 16/32 (2006.01); G06F 12/02 (2006.01); G11C 16/04 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0611 (2013.01); G06F 3/065 (2013.01); G06F 3/0629 (2013.01); G06F 3/0659 (2013.01); G06F 3/0688 (2013.01); G06F 12/0246 (2013.01); G11C 7/22 (2013.01); G11C 11/005 (2013.01); G11C 16/32 (2013.01); G11C 29/023 (2013.01); G11C 29/028 (2013.01); G11C 29/50012 (2013.01); G11C 16/0483 (2013.01);
Abstract

A sequencer circuit is configured to generate control signals for on-die memory control circuitry. The control signals may include memory operation pulses for implementing operations on selected non-volatile memory cells embodied within the same die as the sequencer (and other on-die memory control circuitry). The timing, configuration, and/or duration of the memory control signals are defined in configuration data, which can be modified after the design and/or fabrication of the die and/or on-die memory circuitry. As such, the timing, configuration, and/or duration of the memory control signals generated by the sequencer may be manipulated after the design and/or fabrication of the die, sequencer, and other on-die memory control circuitry.


Find Patent Forward Citations

Loading…