The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Sep. 17, 2015
Oerlikon Surface Solutions Ag, Pfaffikon, Pfaffikon SZ, CH;
Hitachi Metals, Ltd., Tokyo, JP;
Mitsubishi Hitachi Tool Engineering, Ltd., Tokyo, JP;
Denis Kurapov, Walenstadt, CH;
Tomoya Sasaki, Yasugi, JP;
Shuho Koseki, Yasugi, JP;
Kana Morishita, Yasugi, JP;
Saleh Breik Abusuilik, Yasugi, JP;
Kenichi Inoue, Narita, JP;
OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON, Pfäffikon SZ, CH;
HITACHI METALS, LTD., Tokyo, JP;
MITSUBISHI HITACHI TOOL ENGINEERING, LTD., Tokyo, JP;
Abstract
A method for producing a tool coated with a hard coating, the method including the following steps: applying a TiAIN coating layer onto a substrate with a first magnetron sputtering process and applying a TiSiN coating layer onto the TiAIN layer with a second magnetron sputtering process, where x is smaller than or equal to 0.85 and preferably between and including 0.80 and 0.70 whereas the second magnetron sputtering process is performed with power densities greater than 100 W/cmand as such is a HIPIMS process.