The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Aug. 02, 2016
Applicant:

Elite Electronic Material(zhongshan) Co., Ltd., Zhongshan, Guangdong Province, CN;

Inventors:

Zhi-Long Hu, Zhongshan, CN;

Chen-Yu Hsieh, Taoyuan, TW;

Assignee:

Elite Electronic Material(Zhongshan) Co., Ltd., Zhongshan, Guangdong Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/5313 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); C09D 5/18 (2006.01); C09D 171/12 (2006.01); C08L 71/12 (2006.01); C08K 3/36 (2006.01); C08K 5/14 (2006.01); C09D 7/61 (2018.01);
U.S. Cl.
CPC ...
C08K 5/5313 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/14 (2013.01); C08L 71/126 (2013.01); C09D 5/18 (2013.01); C09D 7/61 (2018.01); C09D 171/12 (2013.01); H05K 1/0373 (2013.01); C08J 2371/12 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); H05K 1/0326 (2013.01); H05K 2201/012 (2013.01);
Abstract

The present invention relates to resin composite materials, and more particularly, to low-dielectric resin composition and prepreg, resin film, resin coated copper, laminate and printed circuit board formed therefrom. The low-dielectric resin composition includes a phosphorus-containing flame retardant as shown in formula (I) and a resin with an active unsaturated bond. The low-dielectric resin composition may further be manufactured as a prepreg, a resin film, a resin coated copper, a laminate, or a printed circuit board, having a high glass transition temperature, low dielectric property, halogen-free flame retardancy and low percent of thermal expansion of laminate.


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