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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10626222 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Mar. 16, 2018

Organic group-modified organosilicon resin, making method, and cosmetics

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takuya Abe, Annaka, JP;

Masayuki Konishi, Tokyo, JP;

Chihiro Hayakawa, Tokyo, JP;

Masanao Kamei, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C08G 77/38 (2006.01); C08G 77/46 (2006.01); A61Q 1/00 (2006.01); A61Q 1/06 (2006.01); A61Q 1/10 (2006.01); A61Q 1/12 (2006.01); A61Q 17/04 (2006.01); A61K 8/895 (2006.01); A61K 8/893 (2006.01); A61K 8/894 (2006.01); A61Q 19/00 (2006.01); C08L 83/12 (2006.01); A61K 8/06 (2006.01); A61Q 5/00 (2006.01); C08G 77/06 (2006.01); A61Q 1/08 (2006.01); A61Q 5/12 (2006.01); A61Q 5/06 (2006.01); A61Q 1/02 (2006.01);
U.S. Cl.
CPC ...
C08G 77/38 (2013.01); A61K 8/064 (2013.01); A61K 8/893 (2013.01); A61K 8/894 (2013.01); A61K 8/895 (2013.01); A61Q 1/00 (2013.01); A61Q 1/06 (2013.01); A61Q 1/10 (2013.01); A61Q 1/12 (2013.01); A61Q 5/00 (2013.01); A61Q 17/04 (2013.01); A61Q 19/00 (2013.01); C08G 77/06 (2013.01); C08G 77/46 (2013.01); C08L 83/12 (2013.01); A61K 2800/10 (2013.01); A61Q 1/02 (2013.01); A61Q 1/08 (2013.01); A61Q 5/06 (2013.01); A61Q 5/12 (2013.01);
Abstract

An organic group-modified organosilicon resin having the average compositional formula (1), which is solid or liquid at 25° C., is suited for use in cosmetics. The resin is able to form an emulsion having a pleasant feel on use, a high internal water phase, and stability over time. In formula (1), a, b, c, d, e, and f are numbers: 0≤a≤400, 0<b≤200, 0≤c≤400, 0≤d≤320, 0≤e≤320, 0<f≤1,000, and 0.5≤(a+b+c)/f≤1.5.(RSiO)(RSiO)(RSiO)(RSiO)(RSiO)(SiO)  (1)

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