The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Oct. 12, 2016
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Kazunobu Kamiya, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/24 (2006.01); C08G 18/28 (2006.01); C08G 18/80 (2006.01); C08G 18/22 (2006.01); C08G 59/18 (2006.01); C08G 59/40 (2006.01); C08K 5/5415 (2006.01); C08G 59/70 (2006.01);
U.S. Cl.
CPC ...
C08G 59/70 (2013.01); C08G 18/222 (2013.01); C08G 18/289 (2013.01); C08G 18/8029 (2013.01); C08G 59/188 (2013.01); C08G 59/24 (2013.01); C08G 59/245 (2013.01); C08G 59/40 (2013.01); C08K 5/5415 (2013.01);
Abstract

An aluminum-chelate-based latent curing agent is capable of showing excellent solvent resistance and excellent storage stability at room temperature without impairing low temperature rapid curability of resin composition, when preparing one-pack type thermosetting epoxy resin composition by blending aluminum-chelate-based latent curing agent holding aluminum-chelating agent on porous resin particles obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization into alicyclic epoxy resin showing extremely high cationic polymerizability. Aluminum-chelate-based latent curing agent for curing thermosetting epoxy resin is configured such that aluminum-chelating agent is held on porous resin obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization, and that surface activity inhibition treatment is performed by epoxy-alkoxy-silane coupling agent.


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