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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10625495 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jun. 01, 2016

Scratch repair film

Applicant:

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventor:

Shinji Kikuchi, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka-Shi, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Margaret G Moore

Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/28 (2006.01); C09D 183/06 (2006.01); B32B 27/00 (2006.01); B32B 27/18 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); C08J 7/04 (2020.01); C09D 7/47 (2018.01); C08G 77/14 (2006.01); C09D 7/65 (2018.01);
U.S. Cl.
CPC ...
B32B 27/283 (2013.01); B32B 27/00 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); C08J 7/047 (2013.01); C09D 183/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/762 (2013.01); C08G 77/14 (2013.01); C08J 2367/02 (2013.01); C08J 2483/06 (2013.01); C09D 7/47 (2018.01); C09D 7/65 (2018.01);
Abstract

Provided is a scratch self-repairing film including a hardcoat layer that has surface hardness, flexibility, and heat resistance at high levels and offers excellent workability. The scratch self-repairing film according to the present invention includes a substrate layer, a hardcoat layer on or over one side of the substrate layer, and a flexible resin layer on or over the other side of the substrate layer. The hardcoat layer includes a cured product of a curable composition. The curable composition includes a cationically curable silicone resin and a leveling agent. The cationically curable silicone resin includes a silsesquioxane unit. The cationically curable silicone resin includes an epoxy-containing monomeric unit in a proportion of 50 mole percent or more of the totality of all monomeric units and has a number-average molecular weight of 1000 to 3000.

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