The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jan. 08, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Seitaro Washizuka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/0233 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01);
Abstract

A bonding member having a container between a first foil and a second foil. The container includes metal particles having a melting point higher than a melting point of the first foil and a melting point of the second foil, a film material in which the metal particles are dispersed, and intermetallic compounds formed by a reaction between the first foil or the second foil and the metal particles. The first foil and the metal particles are bonded with the intermetallic compound interposed therebetween, and the second foil and the metal particles are bonded with the intermetallic compound interposed therebetween.


Find Patent Forward Citations

Washizuka, Seitaro. (2020). Bonding member and method for manufacturing bonding member (U.S. Patent No. 10625377). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10625377

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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