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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10625376 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jan. 08, 2018

Bonding member, method for manufacturing bonding member, and bonding method

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Seitaro Washizuka, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/02 (2006.01); C22C 9/00 (2006.01); B23K 35/26 (2006.01); B23K 35/40 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); C22C 9/06 (2006.01); B23K 1/00 (2006.01); B23K 35/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0227 (2013.01); B23K 1/00 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); B23K 35/40 (2013.01); B23K 35/406 (2013.01); C22C 9/00 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3457 (2013.01); H05K 3/3489 (2013.01); H05K 2203/0405 (2013.01); H05K 2203/049 (2013.01); H05K 2203/0415 (2013.01);
Abstract

A bonding member that includes a base material that has a spiral shape when viewing a cross section thereof orthogonal to a longitudinal direction thereof, and contains a low melting point metal; and a coating film in a gap between opposed surfaces of the base material when the base material is in the spiral shape. The coating film contains metal particles of a high melting point metal that forms an intermetallic compound having a melting point higher than that of the low melting point metal by reaction of the high melting point metal with a melt of the low melting point metal. The low melting point metal is, for example, Sn or a Sn alloy. The high melting point metal is, for example, a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Cr alloy, or a Cu—Al alloy.

Find Patent Forward Citations

Washizuka, Seitaro. (2020). Bonding member, method for manufacturing bonding member, and bonding method (U.S. Patent No. 10625376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10625376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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