The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Aug. 23, 2016
Applicants:

Hyuck Choo, San Marino, CA (US);

Hyun Jun Cho, Pasadena, CA (US);

Inventors:

Hyuck Choo, San Marino, CA (US);

Hyun Jun Cho, Pasadena, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/113 (2006.01); A61N 1/378 (2006.01); H02N 2/18 (2006.01); A61N 1/36 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3785 (2013.01); H01L 41/1136 (2013.01); H02N 2/188 (2013.01); A61N 1/3605 (2013.01); A61N 1/36007 (2013.01); A61N 1/36036 (2017.08); A61N 1/36046 (2013.01);
Abstract

Apparatus and methods are provided for the generation of electrical power from acousto-mechanical vibrations originating from the vocal folds of the human body. The apparatus and methods can include one or more beams comprising a piezoelectric material, such as lead zirconate titanate (PZT), coupled to a power circuitry. Each of the one or more beams can also have a predetermined resonance frequency that is within the dominant frequency range of the human voice. The power circuitry can be adapted to receive the electrical charge received by the one or more piezoelectric beams and to convert the electrical charge into an electric current. The power circuitry can also be coupled to a battery for the storage of the converted energy, which in turn can provide power to implantable medical electronic devices (e.g., neurostimulators or cochlear implants) and/or wearable electronics. Numerous piezoelectric beam shapes, device packaging structures and array configurations are also disclosed that can provide improved power generation and reduced damping effects.


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