The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Feb. 21, 2017
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 5/06 (2006.01); B29C 45/14 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); B29K 101/12 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); B29C 45/14639 (2013.01); H05K 1/188 (2013.01); H05K 5/065 (2013.01); H05K 9/0022 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3425 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 3/284 (2013.01); Y10T 29/49146 (2015.01);
Abstract
An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.