The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 04, 2015
Applicant:

Preh Gmbh, Bad Neustadt a. d. Saale, DE;

Inventor:

Adam Theander, Bankeryd, SE;

Assignee:

PREH GMBH, Bad Neustadt A. D. Saale, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20927 (2013.01); H01L 23/4006 (2013.01); H01L 23/4093 (2013.01); H01L 23/473 (2013.01); H01L 25/00 (2013.01); H05K 1/0203 (2013.01);
Abstract

An automotive power electronics assembly, including: a cover plate, a cooling pipe received in a groove extending along a first surface of the cover plate, a plurality of metallic heat sink bodies provided on a second, opposite surface of the cover plate wherein first end faces of the hear sink bodies are in heat conducting contact with the cover plate, each heat sink body carrying on a side surface at least one semiconductor component to be cooled, and a printed circuit board providing electronic contacts to the semiconductor components, where the printed circuit board is in contact with second end faces of the heat sink bodies. Each heat sink body tapers from the first end face to the second end face such that the contact area with the cover plate is larger than the contact area with the printed circuit board.


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