The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Oct. 03, 2017
Applicant:

Iriso Electronics Co., Ltd., Kanagawa, JP;

Inventors:

Yujiro Sugaya, Kanagawa, JP;

Yuki Asanuma, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01); H05K 3/40 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 1/112 (2013.01); H05K 1/144 (2013.01); H05K 3/366 (2013.01); H05K 3/4038 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/041 (2013.01); H05K 2201/098 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10265 (2013.01);
Abstract

To provide a circuit board that is capable of establishing electrical connection, that is thinner, and that has a higher maintainability. A circuit board includes a substrate including a hole portion that penetrates the substrate in a plate thickness direction, and a connector region including a first conductor layer that closes one side of the hole portion, liquid metal disposed in a recess formed by the hole portion and the first conductor layer, and a sealing layer that is the liquid metal cured on a liquid surface side. The liquid metal may be in contact with a second conductor layer formed in the recess.


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