The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jul. 06, 2018
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, CN;
Hisense Usa Corporation, Suwanee, GA (US);
Hisense International Co., Ltd., Qingdao, CN;
Sigeng Yang, Qingdao, CN;
Shijian Ben, Qingdao, CN;
Jingsheng Xia, Qingdao, CN;
Yongliang Huang, Qingdao, CN;
Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, CN;
Hisense USA Corporation, Suwanee, GA (US);
Hisense International Co., Ltd., Qingdao, CN;
Abstract
The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.