The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 03, 2017
Applicant:

Starfire Industries, Llc, Champaign, IL (US);

Inventors:

Robert A. Stubbers, Savoy, IL (US);

Brian E. Jurczyk, Champaign, IL (US);

Thomas J. Houlahan, Jr., Urbana, IL (US);

James M. Potter, Los Alamos, NM (US);

Assignee:

Starfire Industries, LLC, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H 7/02 (2006.01); H05H 7/18 (2006.01); H01J 3/02 (2006.01);
U.S. Cl.
CPC ...
H05H 7/02 (2013.01); H05H 7/18 (2013.01); H01J 3/027 (2013.01); H01J 3/028 (2013.01); H05H 2007/025 (2013.01);
Abstract

A system for injecting radio frequency (RF) pulses into an RF linear accelerator (RF LINAC) cavity is described. In accordance with the description an RF power amplifying element, typically a compact planar triode (CPT), is directly mounted to an outside of a hermetically sealed RF cavity. The direct mounting of the RF power amplifying element places the antenna—responsible for coupling power into the RF cavity—physically on the RF cavity side of a hermetic high-voltage (HV) break. The RF input, RF circuitry, biasing circuitry, and RF power amplifier are all outside of the vacuum cavity region. The direct mounting arrangement facilitates easy inspection and replacement of the RF power amplifier, the RF input and biasing circuitry. The direct mounting arrangement also mitigates the deleterious effects of multipactoring associated with placing the RF power amplifier and associated RF circuitry in the vacuum environment of the RF LINAC cavity.


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