The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Jul. 10, 2018
Applicant:

Futurewei Technologies, Inc., Plano, TX (US);

Inventors:

Munawar Kermalli, Morris Plains, NJ (US);

Michael Russo, Morris Plains, NJ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/57 (2011.01); H01R 12/70 (2011.01); H01R 43/02 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 12/707 (2013.01); H01R 12/716 (2013.01); H01R 43/0256 (2013.01);
Abstract

A radio frequency (RF) device includes a first and second substrate, a first and second circuit, and an interconnect circuit. Each substrate having a first surface and an opposing second surface, a thickness of the second substrate being greater than a thickness of the first substrate, the second substrate having an overhang portion extending over the first surface of the first substrate. The first circuit disposed on the first substrate having a first contact terminal on the first surface of the first substrate. The second circuit disposed on the second substrate, the second circuit having a second contact terminal on the first surface of the second substrate. The interconnect circuit disposed on the overhang portion of the second substrate. The interconnect circuit including a vertical metal structure electrically connecting the first contact terminal to the second contact terminal.


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