The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Aug. 29, 2017
Applicant:

Allegro Microsystems, Llc, Manchester, NH (US);

Inventors:

Sundar Chetlur, Bedford, NH (US);

Harianto Wong, Southborough, MA (US);

Maxim Klebanov, Manchester, NH (US);

William P. Taylor, Amherst, NH (US);

Michael C. Doogue, Bedford, NH (US);

Assignee:

Allegro MicroSystems, LLC, Manchester, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/00 (2006.01); H01L 43/06 (2006.01); H01L 43/04 (2006.01); H01L 25/065 (2006.01); H01L 43/14 (2006.01); H01L 23/64 (2006.01); H01L 23/538 (2006.01); H01L 43/08 (2006.01); H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 43/065 (2013.01); H01L 23/538 (2013.01); H01L 23/645 (2013.01); H01L 25/0655 (2013.01); H01L 43/04 (2013.01); H01L 43/14 (2013.01); H01F 5/003 (2013.01); H01L 43/06 (2013.01); H01L 43/08 (2013.01);
Abstract

Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.


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