The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Sep. 05, 2014
Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Theodore Lowes, Lompoc, CA (US);

Kurt W. Wilcox, Libertyville, IL (US);

Bernd Keller, Santa Barbara, CA (US);

Chandan Bhat, Goleta, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/44 (2013.01); H01L 33/505 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01);
Abstract

Emitter packages are disclosed that can include an insulating layer covering the emitter, such as between the emitter's primary emission surface and a lens or encapsulant. The packages can comprise a submount with an emitter flip-chip mounted such that the diode region is between the emitter's non-insulating and/or conductive substrate and the submount. The submount can then be covered with a thin insulating layer. The same or another insulating layer can cover other electrically active surfaces on the submount. By insulating the electrically active surfaces of the emitter and, in some embodiments, other electrically active surfaces, the package can meet UL8750 class 4 enclosure standards even if it does not meet the lens adhesion criteria. This can enable the use of cheaper and/or more optically efficient materials at the fixture level, since the package itself meets class 4 standards.


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