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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10622501 B1

PDFFull Text
Date of Patent:
Apr. 14, 2020

Filed:

Nov. 09, 2016

Co-extruded one-time-formed solar cell module backboard in three-layer structure

Applicant:

Cybrid Technologies Inc., Suzhou, CN;

Inventors:

Hongye Chen, Suzhou, CN;

Lei Wang, Suzhou, CN;

Xiaoping Wu, Suzhou, CN;

Uno Keiichi, Otsu, JP;

Takabatake Hiroshi, Suzhou, CN;

Assignee:

Cybrid Technologies Inc., Suzhou, CN;

Attorneys:

Wayne & Ken, LLC

Tony Hom

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
H01L 31/049 (2014.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/30 (2006.01); H01L 31/048 (2014.01); B32B 7/10 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
H01L 31/049 (2014.12); B32B 7/10 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/30 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/34 (2013.01); B32B 27/365 (2013.01); H01L 31/0481 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2264/102 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2307/406 (2013.01); B32B 2307/416 (2013.01); B32B 2307/54 (2013.01); B32B 2307/71 (2013.01); B32B 2307/712 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7246 (2013.01); B32B 2307/7265 (2013.01); B32B 2307/732 (2013.01); B32B 2307/734 (2013.01); B32B 2457/12 (2013.01); Y10T 428/24 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24967 (2015.01);
Abstract

The present invention discloses a co-extruded one-time-formed solar cell module backboard in a three-layer structure. The backboard is formed by co-extruding three layers: a middle layer located in the middle as well as an outer layer and an inner layer located at two sides of the middle layer, and has high water resisting capability, high reflective rate, good long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance and good recoverability and environmental protection performance. Compared with the prior art, the backboard has better water resisting ability, higher reflectivity, better long-term aging resistance performances of hydrolysis resistance, UV resistance and heat resistance, better recoverability and environmental protection performance and lower cost. Compared with a backboard in a co-extruded structure in the prior art, the backboard of the present invention has better heat resistance, better dimensional stability and higher mechanical breaking strength.

Find Patent Forward Citations

Chen, Hongye. (2020). Co-extruded one-time-formed solar cell module backboard in three-layer structure (U.S. Patent No. 10622501). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10622501

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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