The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Dec. 03, 2018
Applicant:
Hong Kong Beida Jade Bird Display Limited, Hong Kong, CN;
Inventors:
Lei Zhang, Albuquerque, NM (US);
Qiming Li, Albuquerque, NM (US);
Huiwen Xu, Shanghai, CN;
Fang Ou, Monterey Park, CA (US);
Wing Cheung Chong, Hong Kong, CN;
Assignee:
Hong Kong Beida Jade Bird Display Limited, Hong Kong, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01S 5/02 (2006.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01S 5/042 (2006.01); H01S 5/183 (2006.01); H01S 5/026 (2006.01); H01L 33/00 (2010.01); H01S 5/42 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/0753 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01S 5/0216 (2013.01); H01S 5/042 (2013.01); H01S 5/183 (2013.01); H01L 33/0079 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82 (2013.01); H01L 2224/92244 (2013.01); H01L 2933/0066 (2013.01); H01S 5/0217 (2013.01); H01S 5/0261 (2013.01); H01S 5/423 (2013.01);
Abstract
A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the driver circuit wafer, and a horizontally continuous functional device epi-structure layer formed over the bonding metal layer and covering the driver circuits.