The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Feb. 23, 2017
Lg Innotek Co., Ltd., Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
An embodiment relates to a light emitting element package and display device. The light emitting element package according to the embodiment comprises: a substrate; a first light emitting element disposed on the substrate and emitting a red wavelength; a second light emitting element disposed in parallel with the first light emitting element in a first direction and emitting a blue or green wavelength; a third light emitting device disposed in parallel with the first and second light emitting elements in a second direction that is orthogonal to the first direction and emitting a green or blue wavelength; and a molding part covering the first to third light emitting elements, wherein a first upper electrode connected to the first light emitting element, a second upper electrode connected to the second light emitting element, a third upper electrode connected to the third light emitting element, and a fourth upper electrode commonly connected to the first to third light emitting elements are included on the substrate, the first to third light emitting elements are arranged to be misaligned in the first direction, and the centers of the first to third light emitting elements can be arranged within a curvature range having a curvature radius of 250 μm from the center of the substrate. The light emitting element package according to the embodiment can provide full colors, implement uniform color and uniform brightness, and increase a bonding force between the molding part and the substrate. In the embodiment, a configuration can be simplified and slimness can be implemented.