The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Jul. 06, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Thomas J. Brunschwiler, Thalwil, CH;

Sebastian Gerke, Klingnau, CH;

Stefano Sergio Oggioni, Besana in Brianza, IT;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/04 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/50 (2006.01); H05K 1/18 (2006.01); H01G 4/38 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/04 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H05K 1/185 (2013.01); H01G 4/38 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H05K 1/0298 (2013.01); H05K 2201/10636 (2013.01);
Abstract

A circuitized substrate for mounting at least one electronic component having a plurality of terminals. The circuitized substrate includes a first portion of electrical insulating material embedding a first electric circuit for coupling a first subset of the terminals. The first electric circuit including one or more patterned conductive layers of electrically conductive material extending parallel to a plane of the circuitized substrate. The circuitized substrate further includes a second portion of electrically conductive material. One or more insulating elements of electrical insulating material cross the second portion transversally to the plane to insulate a plurality of conductive elements thereof for coupling a second subset of the terminals. One or more auxiliary components of the electronic component are mounted on the second portion. Each auxiliary component having a first terminal and a second terminal coupled with a first one and a second one, respectively, of a pair of the conductive elements.


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