The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Sep. 26, 2018
Applicant:

Fuji Electric Co.,ltd., Kanagawa, JP;

Inventors:

Hiroki Kogawa, Matsumoto, JP;

Takahiro Nishijima, Matsumoto, JP;

Takashi Katsuki, Matsumoto, JP;

Tadahiko Sato, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 23/367 (2013.01); H01L 23/49524 (2013.01); H01L 23/49555 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48247 (2013.01);
Abstract

A semiconductor package is provided, including: a package body; and a plurality of lead terminals exposed from each of at least three side surfaces of the package body, wherein the plurality of lead terminals include: a plurality of lead terminals exposed from a first side surface, half or more of which have tips pointing in a direction along the first side surface; a plurality of lead terminals exposed from a second side surface, all of which have tips pointing in a direction along a direction orthogonal to the second side surface; and a plurality of lead terminals exposed from a third side surface, half or more of which have tips pointing in a direction along the third side surface, or all of which have tips pointing in a direction along a direction orthogonal to the third side surface.


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