The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Feb. 15, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Nicolas Degrenne, Rennes, FR;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 21/4882 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01);
Abstract
The present invention concerns a power module comprising a heat sink, a substrate on which a power die is attached, the power module further comprises between the substrate and the heat sink, a first and a second materials, the first material having a thermal conductivity that is higher than the thermal conductivity of the second material, the second material having a first cavity below the power die and the first material is in the first cavity of the second material.
Quick Actions:
Degrenne, Nicolas. (2020). Power module and method for manufacturing power module (U.S. Patent No. 10622281). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10622281
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile